IDT (Integrated Device Technology) 71V67802S150BQ Mfr Package Description: 13 X 15 MM, FPBGA-165 Technology: CMOS Package Shape: RECTANGULAR Package Style: GRID ARRAY, THIN PROFILE Surface Mount: Yes Terminal Form: BALL Terminal Pitch: 1 mm Terminal Finish: TIN LEAD Terminal Position: BOTTOM Number of Functions: 1 Number of Terminals: 165 Package Body Material: PLASTIC/EPOXY Temperature Grade: COMMERCIAL Memory Width: 18 Organization: 512K X 18 Memory Density: 9.44E6 deg Operating Mode: SYNCHRONOUS Number of Words: 524288 words Number of Words Code: 512K Operating Temperature-Max: 70 Cel Operating Temperature-Min: 0.0 Cel Supply Voltage-Max (Vsup): 3.46 V Supply Voltage-Min (Vsup): 3.14 V Supply Voltage-Nom (Vsup): 3.3 V Memory IC Type: CACHE SRAM Parallel/Serial: PARALLEL Access Time-Max (tACC): 3.8 ns